Temperature Shock Test Chamber

Rapid Thermal Transition Testing for Electronics, Materials, and Critical Components

The FitoTerm 150 CTE2 Temperature Shock Chamber is designed for ultra-fast thermal cycling tests, subjecting devices under test (DUTs) to extreme and sudden temperature changes. Featuring two independent chambers—a hot zone and a cold zone—this system uses an electromechanical elevator to rapidly transfer test objects between the zones with a transfer time of less than 5 seconds, ensuring true thermal shock conditions.

Ideal for reliability testing in electronics, automotive, aerospace, and materials industries, the chamber conforms to international standards for thermal stress validation, solder joint testing, and product durability studies.

Key Features

• Dual-Zone Configuration:
  • Hot Chamber: Ambient to +200 °C
  • Cold Chamber: −75 °C to +60 °C
• Transfer System:
  • Electromechanical elevator for object transfer
  • Transfer speed: ≤ 5 seconds
  • Integrated mechanical deceleration system to minimize vibrations and shock during movement
• Test Volume:
  • Internal Volume: 125 liters
  • Test Space Dimensions (H × W × D): 410 × 470 × 650 mm
  • Maximum Load Capacity (Cradle): 50 kg
• Air Management:
  • High-speed air circulation ensures uniform heating and cooling
  • Cold chamber includes dynamic airflow (2 m/s) for improved temperature homogenization

Typical Applications

• Thermal shock testing for electronic components and circuit boards
• Stress testing for aerospace and automotive parts
• Qualification of materials under rapid thermal transition
• MIL-STD, IEC, JEDEC and other standard-compliant testing
• Reliability studies for semiconductors, connectors, and composite materials